Electronic circuit board with internal optically transmissive layer forming optical bus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 18, 1995
Grant Date -
N/A
app pub date -
Dec 1, 1993
filing date -
Dec 3, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of constructing an electronic circuit assembly comprises forming a circuit board having first and second sets of circuit layers and an internal optically transmissive layer, sandwiched between the first and second sets of circuit layers. Holes are formed through the first set of circuit layers by excimer laser drilling, the holes extending as far as the optically transmissive layer without passing through that layer. Electronic devices are mounted on the circuit board over said holes, at least some of the devices including optical receiver and/or transmitter means for receiving/transmitting optical signals from/to the optically transmissive layer. An optical fibre is coupled to the optically transmissive layer. The optically transmissive layer thus acts as a bus interconnecting the devices.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully