Process for the manufacture of integrated capacitive transducers
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United States of America Patent
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Apr 25, 1995
Grant Date -
N/A
app pub date -
Nov 5, 1993
filing date -
Nov 5, 1992
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Abstract
The process notably consists of assembling by welding by means of a connecting layer (16) a first (10) and a second substrate (12) of a semiconductor material, of thinning the second substrate (12) and, for each of the transducers, of structuring this second thinned substrate (12) to form a network of orifices (24) and of defining the contour of the fixed electrode of the transducer, of etching the first substrate (10) to form the diaphragm (28) of the transducer, and of eliminating the part of the connecting layer (16) which is located between the diaphragm (28) and the network of orifices (24) to separate this diaphragm (28) from the fixed electrode. The invention has applications in the manufacture of transducers such as microphones.
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