Probing device setting a probe card parallel
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United States of America Patent
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-
Apr 25, 1995
Grant Date -
N/A
app pub date -
Jun 1, 1993
filing date -
Jun 1, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A probe apparatus comprises a test head for electrically testing a chip of a semiconductor wafer, a probe card having a plurality of probe needles electrically connected to the test head, a table plate for supporting the semiconductor wafer such that the semiconductor wafer faces the probe card, a CCD camera for detecting heights at predetermined two pairs of points on the probe card and outputting signals corresponding to the heights, and three leg members for driving the table plate such that the semiconductor wafer supported by the table plate is parallel to the probe card, on the basis of distances between the two pairs of points in X- and Y-directions which are obtained from X- and Y-directional movement amounts of the table plate.
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