Substrate cooling device and substrate heat-treating apparatus
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United States of America Patent
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-
May 2, 1995
Grant Date -
N/A
app pub date -
Feb 7, 1994
filing date -
Feb 12, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A treating chamber includes a cooling plate assembly for supporting and cooling a substrate and an auxiliary cooling plate disposed on or adjacent a ceiling of the treating chamber. The auxiliary cooling plate reduces an atmospheric temperature in a space above the substrate supported on the cooling plate assembly to a target temperature to which the substrate is to be cooled by the cooling plate assembly. Consequently, the substrate having undergone a high temperature treatment is cooled quickly to the target temperature, and improved uniformity of temperature distribution is secured over a substrate surface after the cooling step.
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