Electroplating bath and process for white palladium
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United States of America Patent
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May 16, 1995
Grant Date -
N/A
app pub date -
Aug 16, 1993
filing date -
Aug 16, 1993
priority date (Note) -
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Abstract
The present invention relates to an improved metallic additive free palladium electroplating bath comprising the use of a sulfonic acid compound in combination with a special class of pyridine related nitrogen compounds to both stabilize the bath and to provide white palladium deposits over a wide range of plating thicknesses.
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