Importance

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Abstract

This invention includes a method of making a bridge-supported accelerometer structure. A first wafer is worked, preferably by bulk micromachining, to provide a proof mass supported by a thin membrane on all sides. The thin membrane has the same thickness as the bridges to be defined therein. The first wafer is bonded to a second wafer having a cavity formed therein. The first wafer is then worked, preferably by plasma etching, to delineate bridges in the thin membrane. The cavity in the second wafer provides damping of the proof mass which reduced bridge breakage as portions of the thin membrane are removed leaving the final bridge-supported accelerometer structure. Combining the two wafers together prior to delineating the bridge provides for handling and processing of a much less fragile structure than the first wafer alone with bridges delineated therein.

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First Claim