Printed wiring board having an electromagnetic wave shielding layer

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United States of America Patent

PATENT NO 5416667
SERIAL NO

08087848

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed wiring board comprises a substrate, a printed wiring circuit formed on the substrate, and insulating layer formed on the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer, and an overcoat layer provided on the electromagnetic shielding layer. The electromagnetic shielding layer has a first color, and the overcoat layer has a second color different from the first color. The color of the overcoat layer may be any color which is easily visually distinguishable from the color of the electromagnetic wave shielding layer so that visual inspection of the working condition of the overcoat layer is facilitated.

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Patent Owner(s)

Patent OwnerAddress
NIPPON CMK CORP1106 FUJIKUBO MIYOSHI-CHO IRUMA-GUN SAITAMA JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Junichi Iruma, JP 76 575
Kawakami, Shin Iruma, JP 33 461
Nikaido, Katsutomo Iruma, JP 11 106

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