Epoxy resin compositions and semiconductor devices encapsulated therewith
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United States of America Patent
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May 23, 1995
Issued Date -
N/A
app pub date -
Jan 27, 1994
filing date -
Mar 29, 1991
priority date (Note) -
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Abstract
An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
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