Ultra high density modular integrated circuit package

United States of America Patent

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May 30, 1995
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Oct 8, 1993
filing date
Aug 1, 1990

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Abstract

A multiple-element modular package is provided which includes a plurality of level-one packages in horizontal or vertical stacked configuration.

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Patent Owner(s)

Patent Owner	Address
ENTORIAN TECHNOLOGIES INC	4030 W BRAKER LN BUILDING 2 STE 100 AUSTIN TX 78759

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Burns, Carmen D	Austin, TX	72	4439

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Ultra high density modular integrated circuit package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

08133397

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PATENT NO	5420751
SERIAL NO	08133397
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08133397

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