Method of producing a radio frequency transponder with a molded environmentally sealed package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 30, 1995
Issued Date -
N/A
app pub date -
Jun 11, 1993
filing date -
Feb 11, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead type substrate frame, the components are encapsulated in a plastic housing in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads, and then severing the leads at the periphery of the housing to provide a leadless package. The frame may be formed of a conductive material, an insulating material or as a printed circuit board. A novel printed circuit type lead frame whereby a coil of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully