Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus
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United States of America Patent
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Jun 6, 1995
Issued Date -
N/A
app pub date -
Apr 8, 1993
filing date -
Jan 22, 1990
priority date (Note) -
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Abstract
An apparatus for planarizing semiconductor wafers in its preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer and a motor for rotating the platen. A non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. A polishing head holds the surface of the semiconductor wafer in juxtaposition relative to the non-circular pad. A polishing head displacement mechanism moves the polishing head and semiconductor wafer across and past a peripheral edge of the non-circular pad to effectuate a uniform polish of the semiconductor wafer surface. Also disclosed is a method for planarizing a semiconductor surface using a non-circular polishing pad.
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