Flexible substrate with projections to block resin flow
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United States of America Patent
Stats
-
Jun 6, 1995
Issued Date -
N/A
app pub date -
Dec 10, 1993
filing date -
Feb 13, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible substrate to be used for assemblage of a semiconductor chip having connecting points to be electrically connected to an external side, comprises a base film unit made of a flexible synthetic resin and including a mounting portion for mounting thereon a semiconductor chip, groups of conductive leads formed on a surface of the base film unit, each lead group including a plurality of the leads formed so as to extend from respective positions in the mounting portion corresponding to the connecting points of the semiconductor chip as mounted in the mounting portion to selected positions on the base film unit, and a plurality of projections each formed at an area between adjacent two of the lead groups on the surface of the base film unit and having a height substantially equal to the height of the leads of the lead group.
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