Method of making mold-packaged pressure sensing semiconductor device
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United States of America Patent
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Jun 13, 1995
Issued Date -
N/A
app pub date -
Dec 15, 1993
filing date -
Jan 23, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor element (50) is bonded to a die bonding pad (4). The pressure sensor element (50) is thereafter entirely covered with epoxy resin (11) and completely packaged. Following this, the epoxy resin (11) is locally removed at a portion above a diaphragm (5) of the pressure sensor element (50). As a result, the diaphragm (5) is exposed. In this method, the diaphragm (5) is uncovered without using a special metallic mold which prohibits the epoxy resin (11) from flowing into a space above the diaphragm (5). A gold wire (8) is also molded by the package sealing. Thus, a resulting package-molded pressure sensing semiconductor device is highly reliable under adverse environmental conditions and considerably cost-effective.
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