Curable organosiloxane compositions containing low temperature reactive adhesion additives
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United States of America Patent
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Jun 13, 1995
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N/A
app pub date -
May 10, 1994
filing date -
May 10, 1994
priority date (Note) -
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Abstract
The presence in curable organosiloxane compositions of a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds imparts cohesive bonding to a variety of substrates during curing of the compositions. At least one hydrocarbyloxy group on each silicon atom is derived from an alcohol containing at least two hydroxyl groups per molecule and the remaining hydrocarbyloxy groups are alkoxy. The adhesion additives are particularly effective for compositions cured at temperatures up to 100.degree. C.
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