US Patent No: 5,424,384
Number of patents in Portfolio can not be more than 2000
Curable organosiloxane compositions containing low temperature reactive adhesion additives
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Jun 13, 1995
Issued date -
May 10, 1994
filing date -
08/240,598
serial no -
In Force
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Abstract
The presence in curable organosiloxane compositions of a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds imparts cohesive bonding to a variety of substrates during curing of the compositions. At least one hydrocarbyloxy group on each silicon atom is derived from an alcohol containing at least two hydroxyl groups per molecule and the remaining hydrocarbyloxy groups are alkoxy. The adhesion additives are particularly effective for compositions cured at temperatures up to 100.degree. C.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,677,161 Curable organosiloxane compositions | 20 | 1986 | |
| 4,786,701 Curable organosiloxane composition | 12 | 1987 | |
| 4,906,686 Curable organopolysiloxane composition | 16 | 1988 | |
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| 4,659,851 Novel organosilicon compounds | 24 | 1986 | |
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| 4,732,932 Curable organopolysiloxane compositions with improved adhesion | 16 | 1986 | |
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| 4,719,262 Organosilicon primer compositions | 41 | 1986 | |
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| 4,329,273 Self-bonding silicone rubber compositions | 17 | 1980 | |
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| 4,196,273 Curable organopolysiloxane compositions | 34 | 1978 | |
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| 5,106,933 Adhesive silicone compositions | 11 | 1990 | |