Method and apparatus for testing an unpackaged semiconductor die
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United States of America Patent
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Jun 13, 1995
Grant Date -
N/A
app pub date -
Jun 10, 1992
filing date -
Jun 10, 1992
priority date (Note) -
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Abstract
A method and apparatus for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The apparatus employs a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior leads with conductive traces. The back side of a semiconductor die to be tested is removably mounted to a lid, and the bond pads on the die are aligned with the contact pads on the interior of the package. The lid is attached to the package thereby electrically coupling the contact pads with the bond pads on the die. Since the package has conventional exterior form and function the package is operational as a functioning device.
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