Bonding tool, production and handling thereof
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United States of America Patent
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Jun 20, 1995
Issued Date -
N/A
app pub date -
Oct 6, 1994
filing date -
Jul 1, 1992
priority date (Note) -
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Abstract
A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of the concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.
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