Imaging process
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United States of America Patent
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Jun 27, 1995
Issued Date -
N/A
app pub date -
Mar 9, 1994
filing date -
Sep 10, 1992
priority date (Note) -
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Abstract
A novel imaging process is disclosed comprising preparing microcapsules having an elongation of less than 1%, adhering the microcapsules to a substrate then imagewise rupturing certain of said microcapsules upon selective application of a thermal energy input comprising a .DELTA.T of at least 115.degree. C. per 1 millisecond. The process makes use of novel microcapsules polymerized at a temperature of from 65.degree. C. to 100.degree. C. which are heat resistant yet heat fracturable upon application of a thermal pulse.
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