Probe structure for testing a semiconductor chip and a press member for same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 27, 1995
Issued Date -
N/A
app pub date -
Jul 7, 1994
filing date -
Jul 18, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A tester applicable to semiconduction chips having a plurality of pins. The tester comprises a TAB tape having an adhesive surface and a plurality of connecting wires attached to the adhesive surface of the TAB tape and connected to a test card. At a probe region of the tester, probe tips are disposed which come into contact with pads of the semiconductor chip to be tested, upon testing. Each probe tip is made of a palladium layer having a serrated edge grown to shape over a nickel film on a portion of each connecting wire, which portion is disposed at the probe region. The tester can test a semiconductor chip having a plurality of pins and carry out simultaneous probings of a semiconductor chip having the number of pins enabling a TAB chip bonding. Both a functional test and a burn-in test may be carried out with a single test system. Since the tester has many sharp probe tips made of dendritic-grown palladium, it can provide an improvement in proving effect. The sharp probe chips also eliminate a non-contact problem.
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