Importance

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Abstract

Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. Gate passages in the cavity inserts are configured to provide a restriction at the edge of each mold cavity, thereby accelerating the flow of liquid resin, rapidly filling the cavities and avoiding the entrapment of gas bubbles. The inserts have mold vent passages which allow for rapid venting of displaced gases from the cavities. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.

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First Claim