Method of manufacturing polyimide multilayer printed wiring boards
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United States of America Patent
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Jul 4, 1995
Grant Date -
N/A
app pub date -
Apr 15, 1994
filing date -
Apr 28, 1993
priority date (Note) -
Expired
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Abstract
An etching process of a conductive layer in manufacturing polyimide multilayer printed wiring boards comprises the steps of dipping in an alkali aqueous solution for patterning the conductive layer, dipping in an acid aqueous solution for neutralizing the alkali residue, and washing with water thereby washing off the alkali residue. A curing process for each of polyimide layers is controlled so as to obtain a polyimide conversion ratio ranging between 60% and 100% after an initial curing process, and to obtain a polyimide conversion ratio close to 100% after formation of an uppermost polyimide layer.
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