Hot-melt adhesive

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United States of America Patent

PATENT NO 5430090
SERIAL NO

08199028

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a polyvinyl acetate resin composition comprising a hydrophilic polyvinyl acetate resin rendered soluble or dispersible in water by partial saponification or introduction of hydrophilic groups (A), a hydroxy fatty acid compound of not less than 6 carbon atoms (B) and a plasticizer (C).

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Patent Owner(s)

Patent OwnerAddress
NIPPON GOHSEI KAGAKU KOGYO KABUSHIKI KAISHAOSAKA-SHI OSAKA 531-0076

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyamoto, Yoshihiko Hirakata, JP 4 28
Saitoh, Masahiro Yao, JP 14 244

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