Method of heat treating a substrate with standby and treatment time periods
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United States of America Patent
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Jul 4, 1995
Issued Date -
N/A
app pub date -
Dec 13, 1993
filing date -
Jun 12, 1990
priority date (Note) -
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Abstract
A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.
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