Semiconductor device, resin for sealing same and method of fabricating same
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United States of America Patent
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-
Jul 4, 1995
Grant Date -
N/A
app pub date -
Jun 18, 1993
filing date -
Jun 22, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device where electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, its size and cost are therefore reduced.
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