Density improvement for planar hybrid wafer scale integration
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 11, 1995
Grant Date -
N/A
app pub date -
Apr 30, 1993
filing date -
Apr 30, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Chip-like stacks of thinned chips are mounted in wells etched into a substrate. A 'chip-like' stack is a stack of chips, which in the aggregate have a height approximately equal to that of a single conventional chip. These chip-like stacks are mounted in a variety of packages. In a preferred embodiment, the stacks are mounted in wells within the substrate of an integrated circuit and the stack is provided with a patterned overlay so that all the circuit connections can be made from the upper surface of the stack. The patterned overlay is protected by a planar insulator. A plurality of substrates may be stacked, one upon the other.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully