Importance

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Abstract

A process for forming a multi-layer integrated circuit utilizes a rigid substrate covered by a dissolvable material layer, which is in turn coated by a protective material layer. Electrically conductive posts and a semiconductive material layer are then sequentially formed on the protective material layer. An integrated circuit is formed in the top surface of the semiconductive material layer. Upper conductive pads are formed on exposed ends of the conductive posts. The substrate, dissolvable material layer and protective material layer support each thin integrated circuit layer during fabrication and are removed to enable the integrated circuits to be interconnected into a stack via the conductive posts and pads. In another embodiment, the rigid substrate is formed of a dissolvable material layer which is in turn coated by a protective, insulating layer. The conductive posts and integrated circuit are formed on the substrate prior to dissolving the substrate to expose top and bottom pads attached to opposite ends of the conductive posts. The top and bottom pads of a plurality of like integrated circuits are connected to provide interconnection of multiple dies in a stacked arrangement.

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First Claim