Method of manufacturing semiconductor device with copper core bumps

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5433822
SERIAL NO

07962190

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AMKOR TECHNOLOGY, INC.CHANDLER, AZ906

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Shingo Tokyo, JP 15 240
Kaneko, Hiroyuki Tokyo, JP 80 551
Mimura, Seiichi Tokyo, JP 11 183
Ohi, Masayuki Tokyo, JP 2 36
Shimizu, Junichiro Tokyo, JP 16 302
Tajiri, Takayuki Tokyo, JP 3 27

Cited Art Landscape

Patent Info (Count) # Cites Year
 
STOVOKOR TECHNOLOGY LLC (1)
* 4926241 Flip substrate for chip mount 146 1988
 
PSI Star (1)
* 4927700 Copper etching process and product with controlled nitrous acid reaction 3 1989
 
MACDERMID ACUMEN, INC. (1)
* 5065228 G-TAB having particular through hole 16 1989
 
Nippon CMK Corp. (1)
* 4991060 Printed circuit board having conductors interconnected by foamed electroconductive paste 16 1989
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
NITTO DENKO CORPORATION (2)
* 5877559 Film carrier for fine-pitched and high density mounting and semiconductor device using same 31 1996
6222272 Film carrier and semiconductor device using same 11 1998
 
CITIBANK, N.A. (1)
* 2007/0137,889 MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD 0 2007
 
IBIDEN CO., LTD. (2)
6831234 Multilayer printed circuit board 14 1997
6525275 Multilayer printed circuit boards 12 1997
 
LUCENT TECHNOLOGIES INC. (1)
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VLSI TECHNOLOGY, INC. (1)
* 5854512 High density leaded ball-grid array package 72 1996
 
FREESCALE SEMICONDUCTOR, INC. (5)
6710265 Multi-strand substrate for ball-grid array assemblies and method 14 2002
* 2003/0027,377 Multi-strand substrate for ball-grid array assemblies and method 1 2002
7199306 Multi-strand substrate for ball-grid array assemblies and method 4 2003
* 2004/0129,452 Multi-strand substrate for ball-grid array assemblies and method 0 2003
7397001 Multi-strand substrate for ball-grid array assemblies and method 3 2007
 
GLOBALFOUNDRIES INC. (2)
* 7402254 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 1 2003
* 2004/0052,945 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 0 2003
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 5959356 Solder ball grid array carrier package with heat sink 150 1997
 
OKI ELECTRIC INDUSTRY CO., LTD. (1)
* 6084300 Compact resin-sealed semiconductor device 18 1997
 
FUJITSU LIMITED (2)
* 6201667 Magnetic disk drive having a relaying flexible printed circuit sheet 23 1997
* 6098271 Method for assembling a magnetic disk drive with a relaying flexible printed circuit sheet 12 1999
 
NXP USA, INC. (2)
7927927 Semiconductor package and method therefor 34 2001
* 2002/0053,452 Semiconductor package and method therefor 1 2001
 
NORTH STAR INNOVATIONS INC. (2)
* 6465743 Multi-strand substrate for ball-grid array assemblies and method 8 1994
* 2008/0289,867 MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD 13 2008
 
HITACHI, LTD. (2)
* 5886409 Electrode structure of wiring substrate of semiconductor device having expanded pitch 49 1997
* 6137185 Electrode structure of a wiring substrate of semiconductor device having expanded pitch 18 1999
 
NEC CORPORATION (1)
* 5869886 Flip chip semiconductor mounting structure with electrically conductive resin 70 1997
 
SOCIONEXT INC. (1)
* 5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure 305 1997
 
CALLAHAN CELLULAR L.L.C. (1)
* 5847455 Molded leadframe ball grid array 35 1995
 
KABUSHIKI KAISHA TOSHIBA (1)
* 5909054 Semiconductor device having a multiple-terminal integrated circuit formed on a circuit substrate 17 1997
 
TESSERA, INC. (3)
* 6002168 Microelectronic component with rigid interposer 101 1997
6208025 Microelectronic component with rigid interposer 15 1999
6573609 Microelectronic component with rigid interposer 35 2001
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 6372547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board 19 1998
6365499 Chip carrier and method of manufacturing and mounting the same 16 2000
* Cited By Examiner