US Patent No: 5,433,822

Number of patents in Portfolio can not be more than 2000

Method of manufacturing semiconductor device with copper core bumps

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Importance

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Abstract

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A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AMKOR TECHNOLOGY, INC.CHANDLER, AZ809

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Shingo Fujisawa, JP 16 219
Kaneko, Hiroyuki Tokyo, JP 91 375
Mimura, Seiichi Tokyo, JP 15 154
Ohi, Masayuki Hsinchu, TW 2 34
Shimizu, Junichiro Hino, JP 26 192
Tajiri, Takayuki Tokyo, JP 2 27

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MACDERMID ACUMEN, INC. (1)
5,065,228 G-TAB having particular through hole 15 1989
 
Nippon CMK Corp. (1)
4,991,060 Printed circuit board having conductors interconnected by foamed electroconductive paste 16 1989
 
PSI Star (1)
4,927,700 Copper etching process and product with controlled nitrous acid reaction 3 1989
 
STOVOKOR TECHNOLOGY LLC (1)
4,926,241 Flip substrate for chip mount 146 1988

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (5)
6,465,743 Multi-strand substrate for ball-grid array assemblies and method 8 1994
7,927,927 Semiconductor package and method therefor 15 2001
6,710,265 Multi-strand substrate for ball-grid array assemblies and method 13 2002
7,199,306 Multi-strand substrate for ball-grid array assemblies and method 3 2003
7,397,001 Multi-strand substrate for ball-grid array assemblies and method 3 2007
 
TESSERA, INC. (3)
6,002,168 Microelectronic component with rigid interposer 65 1997
6,208,025 Microelectronic component with rigid interposer 14 1999
6,573,609 Microelectronic component with rigid interposer 29 2001
 
FUJITSU LIMITED (2)
6,201,667 Magnetic disk drive having a relaying flexible printed circuit sheet 20 1997
6,098,271 Method for assembling a magnetic disk drive with a relaying flexible printed circuit sheet 12 1999
 
HITACHI, LTD. (2)
5,886,409 Electrode structure of wiring substrate of semiconductor device having expanded pitch 46 1997
6,137,185 Electrode structure of a wiring substrate of semiconductor device having expanded pitch 18 1999
 
IBIDEN CO., LTD. (2)
6,831,234 Multilayer printed circuit board 12 1997
6,525,275 Multilayer printed circuit boards 10 1997
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
6,372,547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board 18 1998
6,365,499 Chip carrier and method of manufacturing and mounting the same 16 2000
 
NITTO DENKO CORPORATION (2)
5,877,559 Film carrier for fine-pitched and high density mounting and semiconductor device using same 25 1996
6,222,272 Film carrier and semiconductor device using same 9 1998
 
FUJITSU SEMICONDUCTOR LIMITED (1)
5,726,493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure 231 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,402,254 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 0 2003
 
KABUSHIKI KAISHA TOSHIBA (1)
5,909,054 Semiconductor device having a multiple-terminal integrated circuit formed on a circuit substrate 17 1997
 
LUCENT TECHNOLOGIES INC. (1)
6,175,085 Solder mask configuration for a printed wiring board with improved breakdown voltage performance 4 1998
 
MUCHOSTRO FOUNDATION, L.L.C. (1)
5,847,455 Molded leadframe ball grid array 33 1995
 
NEC CORPORATION (1)
5,869,886 Flip chip semiconductor mounting structure with electrically conductive resin 56 1997
 
OKI ELECTRIC INDUSTRY CO., LTD. (1)
6,084,300 Compact resin-sealed semiconductor device 18 1997
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,959,356 Solder ball grid array carrier package with heat sink 134 1997
 
VLSI TECHNOLOGY, INC. (1)
5,854,512 High density leaded ball-grid array package 63 1996