Process for attaching a lead frame to a heat sink using a glob-top encapsulation

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United States of America Patent

PATENT NO 5434105
SERIAL NO

08206011

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Abstract

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A method is disclosed for packaging an integrated circuit having a heat spreader for cooling an integrated circuit die and glob-topping to both protect bonding wires and attach the heat spreader to a lead frame.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL SEMICONDUCTOR CORPORATION12500 TI BOULEVARD M/S 3999 DALLAS TX 75243

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liou, Shiann-Ming Campbell, CA 84 654

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