Reduced semiconductor size package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 18, 1995
Grant Date -
N/A
app pub date -
Dec 23, 1991
filing date -
Dec 23, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the semiconductor material with a sealant there between. The dimensions of the cover are aligned with the dimensions of the semiconductor. The sealed unit includes electrical contacts extending from outside the sealed unit to the electrical component within the sealed unit on the semiconductor material. The sealed semiconductor unit, including the cover, the semiconductor material, and the electrical component, has an area of the semiconductor material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully