Thermoelectric module having reduced spacing between semiconductor elements
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United States of America Patent
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Jul 18, 1995
Grant Date -
N/A
app pub date -
Oct 22, 1993
filing date -
Oct 22, 1993
priority date (Note) -
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Abstract
A method of manufacturing a thermoelectric module is provided. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.
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