Grid array masking tape process
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United States of America Patent
Stats
-
Jul 25, 1995
Grant Date -
N/A
app pub date -
Mar 29, 1993
filing date -
Mar 29, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Active sites (18) on a semiconductor wafer (14) are protected from particulate and fluid contaminants (40,42)while the wafer (14) is sawed into chips (16) by a tape (62) carrying a pattern of adhesive (64) which is congruent and registerable with saw paths (15) between the active sites (18). Adhering the tape (62) to the wafer (14) encapsulates each active site (18) beneath a non-adherent protective envelope which if formed by adhesive-free portions (68) of the tape (62) as sawing occurs along the saw paths (15) and the congruent adhesive pattern (64). After sawing, the adhesive (64) is treated, as by directing UV through the tape (62), to release the tape (62) from the chips (16).
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Cited Art Landscape
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