Shielded liquid encapsulated semiconductor device and method for making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 25, 1995
Grant Date -
N/A
app pub date -
Jul 5, 1994
filing date -
Jul 5, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor (30) is shielded from electromagnetic interference by a combination of a reference plane (22) of a circuitized substrate (12) and two different encapsulants. The first encapsulant (38) is an electrically insulative encapsulant which mechanically protects a semiconductor die (32). The first encapsulant is constrained by a dam structure (40) so as not to encapsulate conductive reference pads (18) which are electrically connected to the reference plane by conductive vias (20). A second encapsulant (42) is dispensed over the first encapsulant and is in contact with the reference pads. The second encapsulant is an electrically conductive encapsulant, and is preferably made of a precursor material having the same or similar properties as that of the first encapsulant, but is filled with conductive filler particles to establish electrical conductivity of the encapsulant. Accordingly, the semiconductor die is effectively shielded from both the top and bottom by the electrically conductive encapsulant and the reference plane.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully