Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
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United States of America Patent
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Jul 25, 1995
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N/A
app pub date -
Apr 13, 1994
filing date -
Aug 20, 1990
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Abstract
A probing test method including contacting probe of a probe card with pad on an IC chip on a semiconductor wafer, relatively moving each of the probe along the top of each of the pad, and sending test signal to the pad through the probe. Oxide film on the top of each of the pads can be removed by relative motion between each probe and each pad at an area where they are contacted with each other, contact resistance between the probes and the pads can be reduced to a greater extent, and test signal can be more reliable transmitted between the probes and the pads.
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