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Abstract

A composite photodetector substrate is provided that can survive the expected functional stresses of a photodetector array and also reduce the number of photons that complete crosstalk paths in the radiation transparent substrates of typical prior photodetector arrays. The composite substrate includes a semiconductor substrate whose thickness is less than that required to survive typically expected functional stresses of the array, and a carrier bonded to the substrate to give the composite substrate the required strength. The reduced thickness of the semiconductor substrate increases the crosstalk path length which nonabsorbed photons travel between photodetectors. The increased path length includes a greater number of surface reflections, thus reducing the number of photons that complete the crosstalk path. The number is further increased by using a carrier that absorbs the radiation of interest.

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First Claim