Integrated circuit package having a face-to-face IC chip arrangement
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United States of America Patent
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-
Aug 1, 1995
Issued Date -
N/A
app pub date -
Dec 1, 1993
filing date -
Apr 23, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.
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