Thermo-curable resin composition, and a method for producing a copper-clad laminate using same
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United States of America Patent
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Aug 8, 1995
Grant Date -
N/A
app pub date -
Nov 16, 1993
filing date -
Aug 3, 1992
priority date (Note) -
Expired
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Abstract
A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.
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