Resin-packaged semiconductor device with flow prevention dimples
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United States of America Patent
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-
Aug 8, 1995
Grant Date -
N/A
app pub date -
Jan 5, 1994
filing date -
Jan 8, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.
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