High temperature feed-through system and method for making same
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United States of America Patent
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Aug 8, 1995
Grant Date -
N/A
app pub date -
Jul 2, 1993
filing date -
Jul 2, 1993
priority date (Note) -
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Abstract
An electronic feed-through system that is adapted for use in situations in which the feed-through is bonded to a container or the like by a process that subjects the feed-through system to heating. The feed-through system includes an electrically conductive structure adapted to be attached to a second structure at a first location on the conductive structure. The conductive structure has an electrically conducting member connected to the first location. A portion of the conductive structure is subjected to heat during said attachment. The feed-through system also includes an electronic component such as a feed-through capacitor. The electronic component requires electrical connection to the conducting member and placement in proximate spaced relation to the conducting member. An electrically conducting thermally resistant bridge is used to connect the electronic component to the conducting member and maintain the component in the spaced relationship with the member.
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