Thermoelectric cooler
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United States of America Patent
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-
Aug 15, 1995
Issued Date -
N/A
app pub date -
May 24, 1994
filing date -
Feb 1, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoelectric heat pump which is resistant against thermal stresses incurred during thermal cycling of Thermal Cyclers or the like between cold and hot temperatures of about 0.degree. C. at a ramping rate up to about 1.degree. C. per second has improved joints between the thermoelements and electrical conductors which have low electrical resistance and which substantially reduce fractures during thermal cycling. The joints include a tin-silver-indium solder containing by weight about 95% tin, 3.5% silver, and 1.5% indium, or a tin-silver-cadmium solder containing by weight about 95.5% tin, 3.5% silver, and 1.0% cadmium. A robust nickel diffusion barrier between the joints and thermoelectric elements ends provides additional improvement against joint fracture.
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