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Abstract

A method of forming a molded plastic package having an integrated heat sink, without forming mold 'flash' on an external surface of the integrated heat sink during the molding process, is described. The method generally follows conventional fabrication steps for molded plastic packages, except that a protective layer, preferably formed of a water or chemically soluble paste, or a high temperature adhesive tape, is applied to the external surface of the heat sink prior to the formation of the molded plastic package. The protective layer prevents mold 'flash' from forming between the external surface of the heat sink and an inner surface of the mold during the molding process, and after formation of the molded plastic package, acts to protect the external surface of the heat sink from scratches and/or contaminants. The protective layer is readily removable by either dissolving it in water, in a chemical, or peeling it off, depending upon whether the protective layer is formed of a water soluble paste, a chemically soluble paste, or a high temperature adhesive tape, respectively.

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First Claim