Importance

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Abstract

A CMOS motor drive for a disk drive spindle motor. The design of the drive circuit permits the integration of power electronics together with logic or other circuitry on a single integrated circuit wafer. For each motor phase the power electronics formed on the integrated circuit wafer includes a plurality of P-type and N-type MOSFET power transistor pairs and a plurality of corresponding output bonding pads; the drain terminals of each transistor pair being connected together to its corresponding output bonding pad. The wafer is enclosed in packaging which includes an output pin for providing an electrical connection to one phase of the disk drive spindle motor, and a plurality of bond wires corresponding to the plurality of output bonding pads, each bond wire providing an electrical connection between its corresponding bonding pad and the output pin. The transistor pairs and bond wires operate in parallel, each carrying an equivalent portion of the total current output presented at the output pin. The gate terminals of all the P-type MOSFET transistors are electrically connected together to a first control input; and the gate terminals of all the N-type MOSFET transistors are electrically connected together to a second control input. The source terminals of each of the P-type transistors are connected through corresponding bonding pads and bond wires to a first voltage source input pin. Similarly, the source terminals of each of the N-type transistors are connected through corresponding bonding pads and bond wires to a second voltage source input pin.

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First Claim