Method for conditioning a substrate for subsequent electroless metal deposition
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United States of America Patent
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Aug 22, 1995
Issued Date -
N/A
app pub date -
Mar 23, 1992
filing date -
Dec 11, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.
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