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Abstract

A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr--Si--SiO or Ta--Si--SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300.degree. C. of 5.times.10.sup.-8 /.degree.C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 .mu.m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.

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First Claim