Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
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United States of America Patent
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Aug 29, 1995
Issued Date -
N/A
app pub date -
Jun 22, 1994
filing date -
Mar 29, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.
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