Wafer-like processing after sawing DMDs
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United States of America Patent
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-
Aug 29, 1995
Grant Date -
N/A
app pub date -
Jun 24, 1993
filing date -
Jun 24, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.
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