Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
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United States of America Patent
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-
Aug 29, 1995
Issued Date -
N/A
app pub date -
Dec 28, 1994
filing date -
Nov 10, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).
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