Method for mounting semiconductor chip on circuit board
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United States of America Patent
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-
Sep 5, 1995
Grant Date -
N/A
app pub date -
Feb 4, 1994
filing date -
Feb 18, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the circuit board is prevented from warping when heated at a temperature at which the solder bumps melt.
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