Thin semiconductor integrated circuit device assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 5, 1995
Issued Date -
N/A
app pub date -
Jan 17, 1995
filing date -
Aug 20, 1991
priority date (Note) -
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Abstract
A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandwiched between two films. One of the films is in direct contact with the one surface of the chip. The other film is in direct contact with the other surface of the chip.
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