Memory stack with an integrated interconnect and mounting structure
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United States of America Patent
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Sep 5, 1995
Grant Date -
N/A
app pub date -
Jun 1, 1994
filing date -
Jun 1, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A memory stack includes a flexible interconnect device having a plurality of rigid sections connected together by a plurality of flexible sections. Memory devices such as dice or chips are mounted on the flexible interconnect structure and the structure is folded to at the flexible sections to form a stack. Connections among memory device I/Os and interconnect device mounting contacts are made via traces in a signal layer. A thermal conduction layer can be added to increase heat conduction away from the memory devices.
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