Printed circuit having a dielectric covercoat
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 12, 1995
Issued Date -
N/A
app pub date -
Jun 30, 1994
filing date -
Dec 4, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit assembly includes a rigidizer having first and second opposing surfaces, a silicone bonding agent disposed over a first surface of the rigidizer, a flex circuit having first and second opposing surfaces with a first surface of the flex circuit disposed over the bonding agent, and a silicone covercoat disposed over selected portions of the second surface of the flex circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully