Temporary package for bare die test and burn-in
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United States of America Patent
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Sep 19, 1995
Grant Date -
N/A
app pub date -
Jul 27, 1994
filing date -
Jul 27, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A temporary package used to test and burn-in a bare die that will fit in a board mounted socket. The package comprises a base having contacts to engage the die and provide contact to the outer periphery, a lid for pressing the die into electrical contact and a protective cover to restrict the die from damage due to external pressures to the sides or top of the package. The die, lid and protective cover can be assembled onto the base and removed by automated equipment.
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